Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation


3D-stacked processor-memory systems stack memory (DRAM banks) directly on top of logic (CPU cores) using chiplet-on-chiplet packaging technology to provide the next-level computing performance in embedded platforms. Stacking, however, severely increases the system’s power density without any accompanying increase in the heat dissipation capacity. Consequently, 3D-stacked processor-memory systems suffer more severe thermal issues than their non-stacked counterparts. Nevertheless, 3D-stacked processor-memory systems do inherit power (thermal) management knobs from their non-stacked predecessors - namely Dynamic Voltage and Frequency Scaling (DVFS) for cores and Low Power Mode (LPM) for memory banks. In the context of 3D-stacked processor-memory systems, DVFS and LPM are performance- and power-wise deeply intertwined. Their non-unified independent use on 3D-stacked processor-memory systems results in suboptimal thermal management. The unified use of DVFS and LPM for thermal management for 3D-stacked processor-memory systems remains unexplored. The lack of implementation of LPM in thermal simulators for 3D-stacked processor-memory systems hinders real-world representative evaluation for a unified approach. We extend the state-of-the-art interval thermal simulator for 3D-stacked processor-memory systems CoMeT with an LPM power management knob for memory banks. We also propose a learning-based thermal management technique for 3D-stacked processor-memory systems that employ DVFS and LPM in a unified manner. Detailed interval thermal simulations with the extended CoMeT framework show a 10.15% average response time improvement with the PARSEC and SPLASH-2 benchmark suites, along with widely-used Deep Neural Network (DNN) workloads against a state-of-the-art thermal management technique for 2.5D processor-memory systems (ported directly to 3D-stacked processor-memory systems) that also proposes unified use of DVFS and LPM.

ACM Transactions on Embedded Computing Systems
Anuj Pathania
Anuj Pathania
Assistant Professor

Anuj Pathania is an Assistant Professor in the Parallel Computing Systems (PCS) group at the University of Amsterdam (UvA). His research focuses on the design of sustainable systems deployed in power-, thermal-, energy- and reliability-constrained environments.